Terrel Morris
86Patents
13h-index
60Co-inventors
87Inventor score
Filing activity: Oct 30, 1996 → Oct 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6452789B1 | Packaging architecture for 32 processor server | Physics | 106 | Expired |
| US10491302B1 | Rack-level photonic solution | Electricity | 51 | Active |
| US7118285B2 | Optical connections and methods of forming optical connections | Physics | 40 | Expired |
| US6580610B2 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6507101B1 | Lossy RF shield for integrated circuits | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6280201A | Laminated 90-degree connector | Electricity | 31 | Expired |
| US6377458B1 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6313523A | IC die power connection using canted coil spring | Electricity | 28 | Expired |
| US5708400A | AC coupled termination of a printed circuit board power plane in its characteristic impedance | Electricity | 22 | Expired |
| US5838550A | Grounding clip for shielded modular connector | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6061222A | Method and apparatus for reducing noise in integrated circuit chips | Electricity | 17 | Expired |
| US6020749A | Method and apparatus for performing testing of double-sided ball grid array devices | Physics | 16 | Expired |
| US5883788A | Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins | Physics | 13 | Expired |
| US7809278B2 | Apparatus and method of providing separate control and data channels between arrays of light emitters and detectors for optical communication and alignment | Electricity | 11 | Active |
| US7251388B2 | Apparatus for providing optical communication between integrated circuits of different PC boards and an integrated circuit assembly for use therein | Electricity | 10 | Expired |
| US6862185B2 | Systems and methods that use at least one component to remove the heat generated by at least one other component | Electricity | 9 | Expired |
| US9082745B2 | Circuit module | Emerging Cross-Sectional Technologies | 9 | Active |
| US6507492B2 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7269321B2 | System and method of configuring fiber optic communication channels between arrays of emitters and detectors | Physics | 9 | Expired |
| US8315526B2 | Misalignment tolerant free space optical transceiver | Electricity | 9 | Active |
| US8320767B2 | Free-space photonic connection using wavelength division multiplexing and optical antenna | Electricity | 8 | Active |
| US6711021B1 | Systems and methods that use at least one component to remove the heat generated by at least one other component | Electricity | 8 | Expired |
| US6922496B2 | Integrated VCSELs on ASIC module using flexible electrical connections | Electricity | 8 | Expired |
| US6975514B2 | Integrated VCSELs on traditional VLSI packaging | Electricity | 7 | Expired |
| US6309262A | Bifurcated contact with a connecting member at the tip of the contact that provides redundant contact points | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.