Polishing pad and methods relating thereto
US6022264A · kind A · utility
67Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1998 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Feb 10, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, hydrophilic polishing pad capable of releasing particles during polishing. Such a pad design is very efficient in providing polishing particles over the entire polishing surface interface. Since the polishing pad produces polishing particles, the polishing fluid can comprise very low loadings of polishing particles, if any.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.