Method for coupling substrates and structure
US6022761A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1996 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | May 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1517
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for connecting substrates includes using an adhesive interposer structure (11) to bond a semiconductor device (26) to a substrate (18). The adhesive interposer structure (11) includes a non-conductive adhesive laminant (12) and conductive adhesive bumps (13). The conductive adhesive bumps (13) provide a conductive path between conductive bumps (27) on the semiconductor device (26) and conductive metal pads (21) located on the substrate (18). In an alternative embodiment, a conductive adhesive material (34) is screen or stencil printed into vias (39) located on a printed circuit board (38) to form conductive adhesive bumps (33). A non-conductive adhesive (52) is then screen or stencil printed onto the printed circuit board (38) adjacent the conductive adhesive bumps (33). A semiconductor die is then connected to the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.