Jong-Kai Lin
12Patents
8h-index
25Co-inventors
68Inventor score
Filing activity: Jul 25, 1994 → Dec 8, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7651889B2 | Electromagnetic shield formation for integrated circuit die package | Electricity | 84 | Active |
| US6953985B2 | Wafer level MEMS packaging | Electricity | 76 | Expired |
| US5587342A | Method of forming an electrical interconnect | Electricity | 63 | Expired |
| US7648858B2 | Methods and apparatus for EMI shielding in multi-chip modules | Electricity | 54 | Active |
| US5520785A | Method for enhancing aluminum nitride | Emerging Cross-Sectional Technologies | 48 | Expired |
| US6022761A | Method for coupling substrates and structure | Electricity | 46 | Expired |
| US6310403A | Method of manufacturing components and component thereof | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5674780A | Method of forming an electrically conductive polymer bump over an aluminum electrode | Electricity | 30 | Expired |
| US8097494B2 | Method of making an integrated circuit package with shielding via ring structure | Electricity | 4 | Active |
| US8004068B2 | Shielded multi-layer package structures | Electricity | 2 | Active |
| US7869225B2 | Shielding structures for signal paths in electronic devices | Emerging Cross-Sectional Technologies | 1 | Active |
| US8385084B2 | Shielding structures for signal paths in electronic devices | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.