Semiconductor process integration of a guard ring structure
US6022790A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1998 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Aug 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/2527
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is presented for forming a guard ring of a semiconductor device in the termination area in tandem with forming the active area structure of the device. The guard ring is formed using the same processing steps that form the active region structure, at the same time, without requiring additional masking steps or a passivation layer. The guard ring is formed in an opening in the field oxide located in the termination area and is electrically connected to a polysilicon field plate that is located atop a portion of the field oxide region. The guard ring increases the rated voltage of the device without the introduction of a passivation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.