Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance
US6023041A · kind A · utility
16Cited by
44References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a through-via in a laminated substrate by applying a polymeric photo-absorptive layer on an exposed bottom surface of a laminated substrate. A through-via is laser drilled in the substrate from a top of the substrate through the substrate to a bottom of the substrate. The photo-absorptive layer formed on the bottom surface of the substrate is then removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.