Device and method for fragmenting semiconductor material

US6024306A · kind A · utility

Assignee

• Wacker Chemie AG · DE

Inventors

• Franz Koppl · Altötting, DE
• Paul Fuchs · Schalchen, AT

Key dates

• Filing date: Jun 23, 1998
• Grant date: Feb 15, 2000
• Expiry date: Jun 23, 2018

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B02C2019/183
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A method and device for fragmenting semiconductor material, comprising at least two spaced-apart electrodes, which consist of the semiconductor material which is to be fragmented. Each electrode has a heating device. The electrodes pass high voltage current through the semiconductor material to fragment it. The device eliminates the risk of contanimation of the semiconductor material as compared with conventional methods.