Patent · US Expired

High performance pad on pad connector for flex circuit packaging

US6024580A · kind A · utility

17Cited by
6References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 8, 1998
Grant dateFeb 15, 2000
Priority date
Expiry dateJan 8, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/091
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A flex cable pad on pad terminal structure is shown having raised connector pads formed using a rigid stiffener with raised features or bumps formed integral with the stiffener; aligned with the connector pad surfaces; and laminated to the flex cable surface opposite the surface presenting the exposed connector pad surfaces, to create raised contact pads that are not subject to relaxation over time when subjected to high contact normal forces. The use of a metal stiffener which has been coined to produce the raised features aligned with the contact pad locations and lamination using a film or layer of thermocuring adhesive affords an economical process and assembly technique that also effects hot deformation of the flex cable at the contact pad locations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.