Method of reducing agglomerate particles in a polishing slurry
US6024829A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 1998 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | May 21, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method includes transferring a slurry that has a design particle size from a slurry source to an energy source. In many instances, the slurry forms an agglomerate that has an agglomerated particle size, which is substantially larger than the design particle size. This larger particle size is highly undesirable because it can damage the semiconductor wafer surface as it is polished. The method further includes subjecting the agglomerate to energy, such as an ultra sonic wave emanating from the energy source, and transferring energy from the energy source to the slurry to reduce the agglomerated particle size to substantially the design particle size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.