William Easter
71Patents
13h-index
31Co-inventors
84Inventor score
Filing activity: Oct 9, 1987 → Dec 18, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6368190B1 | Electrochemical mechanical planarization apparatus and method | Electricity | 211 | Expired |
| US6059638A | Magnetic force carrier and ring for a polishing apparatus | Performing Operations; Transporting | 48 | Expired |
| US6354928B1 | Polishing apparatus with carrier ring and carrier head employing like polarities | Performing Operations; Transporting | 44 | Expired |
| US4839309A | Fabrication of high-speed dielectrically isolated devices utilizing buried silicide outdiffusion | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6281129A | Corrosion-resistant polishing pad conditioner | Performing Operations; Transporting | 23 | Expired |
| US6234868A | Apparatus and method for conditioning a polishing pad | Performing Operations; Transporting | 21 | Expired |
| US6161278A | Method for inserting wires into a telephone jack connector | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6290883A | Method for making porous CMP article | Performing Operations; Transporting | 20 | Expired |
| US6368955B1 | Method of polishing semiconductor structures using a two-step chemical mechanical planarization with slurry particles having different particle bulk densities | Electricity | 20 | Expired |
| US6150271A | Differential temperature control in chemical mechanical polishing processes | Electricity | 19 | Expired |
| US6024829A | Method of reducing agglomerate particles in a polishing slurry | Performing Operations; Transporting | 17 | Expired |
| US5892292A | Getterer for multi-layer wafers and method for making same | Emerging Cross-Sectional Technologies | 17 | Expired |
| US8961840B1 | Method for producing bulk ceramic components from agglomerations of partially cured gelatinous polymer ceramic precursor resin droplets | Chemistry; Metallurgy | 16 | Active |
| US6514123B1 | Semiconductor polishing pad alignment device for a polishing apparatus and method of use | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5967885A | Method of manufacturing an integrated circuit using chemical mechanical polishing | Performing Operations; Transporting | 12 | Expired |
| US6121142A | Magnetic frictionless gimbal for a polishing apparatus | Performing Operations; Transporting | 12 | Expired |
| US5478758A | Method of making a getterer for multi-layer wafers | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6288648A | Apparatus and method for determining a need to change a polishing pad conditioning wheel | Performing Operations; Transporting | 11 | Expired |
| US9944021B2 | Additive manufacturing 3D printing of advanced ceramics | Emerging Cross-Sectional Technologies | 11 | Active |
| US6551410B2 | Method of cleaning a semiconductor wafer with a cleaning brush assembly having a contractible and expandable arbor | Performing Operations; Transporting | 10 | Expired |
| USH1137H | Wafer bonding technique for dielectric isolation processing | General | 10 | Active |
| US6518987B1 | Mouse and mouse template for a motion impaired user | Physics | 10 | Expired |
| US6726537B1 | Polishing carrier head | Performing Operations; Transporting | 10 | Expired |
| US5366924A | Method of manufacturing an integrated circuit including planarizing a wafer | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6558238B1 | Apparatus and method for reclamation of used polishing slurry | Performing Operations; Transporting | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.