Semiconductor device of SiC with insulating layer and a refractory metal nitride layer
US6025608A · kind A · utility
68Cited by
5References
7Claims
0Family size
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Key dates
| Filing date | Nov 18, 1997 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Nov 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
A semiconductor device comprises at least one semiconductor layer of SiC and a layer of a refractory metal nitride separated by an insulating layer located next to the SiC layer of SiO.sub.2. The insulating layer comprises two sub layers, namely a first sub layer of SiO.sub.2 next to the SiC layer and a second sub layer of Si.sub.3 N.sub.4 located between the first sub layer and the metal nitride layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.