CMOS semiconductor devices and method of formation
US6027961A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1998 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Jun 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/856
Abstract
In one embodiment, a metal layer (18) is formed over a gate dielectric layer (14, 16) on a semiconductor substrate. A masking layer (20) is patterned to mask a portion of the metal layer (18). An exposed portion of the metal layer (18) is nitrided to form a conductive nitride layer (24). The masking layer (20) is removed and the conductive nitride layer (24) is patterned to form a first gate electrode (23) having a first work function value, and the conductive layer (18) is patterned to form a second gate electrode (25) having a second work function value which is different from that of the first work function value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.