Method for maintaining the buffer capacity of siliceous chemical-mechanical silicon polishing slurries
US6028006A · kind A · utility
12Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1997 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Aug 1, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for maintaining the buffer capacity of a polishing slurry during chemical-mechanical wafer polishing, the method comprising circulating the polishing slurry in a chemical-mechanical wafer polishing apparatus, monitoring the pH of the polishing slurry, combining an agent into the polishing slurry to adjust the pH of the polishing slurry and maintaining the pH of the polishing slurry within a predetermined range, thereby maintaining the buffer capacity of the polishing slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.