Low thermal impedance integrated circuit
US6028348A · kind A · utility
31Cited by
4References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 30, 1993 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Nov 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/928
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A frontside ground plane (306) integrated circuit with backside contacts (312) plus optional passive components such as microstrip (308) and capacitors. The frontside ground plane provides direct heat dissipation from active junctions such as heterojunction and field effect transistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.