Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US6030899A · kind A · utility
16Cited by
1References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1999 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Jul 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/932
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution free from particulate matter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.