Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion
US6031216A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1998 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Jun 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding apparatus has a first support arrangement for supporting a first integrated circuit package component. A second support arrangement is configured to supporting a second integrated circuit package component. The second support arrangement includes at least a portion of a heating arrangement for heating certain portions of the second component. At least portions of the first support arrangement are thermally insulated from the second support arrangement such that at least certain portions of the first component may be maintained at a temperature substantially lower than the temperature of the heated portions of the second component. The apparatus may be used in method of forming a bonding wire for electrically connecting a first contact on a first integrated circuit package component to a second contact on a second integrated circuit package component. The method includes the steps of supporting and holding the first component and the second component in a desired position. Certain regions of the second component, including the second contact, are heated to a desired temperature while maintaining the temperature of at least certain portions of the first component, incl…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.