Method of forming thermal conductive structure on printed circuit board
US6032355A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1998 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Aug 6, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a thermal conductive structure on a printed circuit board comprises the steps of forming a thermal conductive layer having an embossed pattern on its surface, and then forming an adhesive glue layer over the thermal conductive layer. Next, a surface metallic layer is attached to the thermal conductive layer and the glue layer, wherein a portion of the surface metallic layer corresponding to the embossed portion of the heat spreader is in direct contact or almost direct contact with the thermal conductive layer. Furthermore, an additional external heat sink can be attached to thermal conductive structure for increasing the efficiency of heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.