World Wiser Electrics Inc.
8Patents
0Active
8Granted
27Portfolio score
Filing activity: Aug 6, 1998 → May 31, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6201300A | Printed circuit board with thermal conductive structure | Emerging Cross-Sectional Technologies | 65 | Expired |
| US6175497A | Thermal vias-provided cavity-down IC package structure | Electricity | 64 | Expired |
| US6395633B1 | Method of forming micro-via | Electricity | 48 | Expired |
| US6326240A | Apparatus for packaging semiconductor device and method for packaging the same | Electricity | 22 | Expired |
| US6032355A | Method of forming thermal conductive structure on printed circuit board | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6264862A | Method for manufacturing a plug | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6115911A | Method of manufacturing a plug | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6270620A | Etching device | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.