Vacuum chuck
US6032997A · kind A · utility
91Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1998 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Apr 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vacuum chuck having a body portion made of moldable glass or another suitable dielectric material including a top surface and bottom surface, a series of flat lands on the top surface of the body portion for supporting a wafer, and a series of orifices and vacuum lines for drawing a vacuum to secure the wafer in place on the lands of the body portion. A method of manufacturing such a vacuum chuck. A method of aligning a wafer on such a vacuum chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.