Chemical mechanical polishing conditioner
US6033290A · kind A · utility
20Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1998 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Sep 29, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.