Apparatus for performing chemical-mechanical polishing
US6033293A · kind A · utility
70Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1997 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Oct 8, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B45/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may comprise a vacuum or electromagnetic force, and the pad has a hard or magnetic backside layer for facing the plating and responding to the attractive force. This invention has particular application to chemical-mechanical polishing for use in planarizing dielectrics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.