Alvaro Maury
26Patents
12h-index
29Co-inventors
81Inventor score
Filing activity: Nov 23, 1984 → Aug 22, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6910907B2 | Contact for use in an integrated circuit and a method of manufacture therefor | Electricity | 103 | Expired |
| US6033293A | Apparatus for performing chemical-mechanical polishing | Performing Operations; Transporting | 70 | Expired |
| US6008123A | Method for using a hardmask to form an opening in a semiconductor substrate | Emerging Cross-Sectional Technologies | 55 | Expired |
| US6372605B1 | Additional etching to decrease polishing time for shallow-trench isolation in semiconductor processing | Electricity | 35 | Expired |
| US6146975A | Shallow trench isolation | Electricity | 25 | Expired |
| US6261958A | Method for performing chemical-mechanical polishing | Performing Operations; Transporting | 25 | Expired |
| US4569722A | Ethylene glycol etch for processes using metal silicides | Electricity | 20 | Expired |
| US4814291A | Method of making devices having thin dielectric layers | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6984166B2 | Zone polishing using variable slurry solid content | Performing Operations; Transporting | 18 | Expired |
| US6110012A | Chemical-mechanical polishing apparatus and method | Performing Operations; Transporting | 18 | Expired |
| US6051500A | Device and method for polishing a semiconductor substrate | Electricity | 16 | Expired |
| US6368972B1 | Method for making an integrated circuit including alignment marks | Electricity | 12 | Expired |
| US6110831A | Method of mechanical polishing | Electricity | 11 | Expired |
| US6274933A | Integrated circuit device having a planar interlevel dielectric layer | Electricity | 10 | Expired |
| US6309900A | Test structures for testing planarization systems and methods for using same | Electricity | 10 | Expired |
| US6821886B1 | IMP TiN barrier metal process | Electricity | 9 | Expired |
| US6624039B1 | Alignment mark having a protective oxide layer for use with shallow trench isolation | Electricity | 9 | Expired |
| US6354910B1 | Apparatus and method for in-situ measurement of polishing pad thickness loss | Performing Operations; Transporting | 4 | Expired |
| US6287173A | Longer lifetime warm-up wafers for polishing systems | Performing Operations; Transporting | 3 | Expired |
| US7163438B2 | Zone polishing using variable slurry solid content | Performing Operations; Transporting | 1 | Expired |
| US7005724B2 | Semiconductor device and a method of manufacture therefor | Electricity | 1 | Expired |
| US6548906B2 | Method for reducing a metal seam in an interconnect structure and a device manufactured thereby | Electricity | 1 | Expired |
| US6281128A | Wafer carrier modification for reduced extraction force | Performing Operations; Transporting | 1 | Expired |
| US6217419A | Chemical-mechanical polisher | Performing Operations; Transporting | 1 | Expired |
| US8872311B2 | Semiconductor device and a method of manufacture therefor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.