Multi-oxidizer slurry for chemical mechanical polishing
US6033596A · kind A · utility
26Cited by
26References
3Claims
0Family size
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Key dates
| Filing date | Feb 18, 1997 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Feb 18, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing slurry comprising a first oxidizer of urea hydrogen peroxide, a second oxidizer, an organic acid, and an abrasive, and a method for using the chemical mechanical polishing slurry to remove titanium, titanium nitride, and an aluminum alloy containing layer from a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.