Semiconductor chip fabrication method and apparatus therefor
US6033934A · kind A · utility
1Cited by
5References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 9, 1997 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Dec 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip fabrication method, including the steps of: (a) attaching dies to a chip carrier and then bonding lead wires to the dies, (b) adhering heat-resisting plastic strips to the chip carrier and connecting them to each die at one corner for guiding a molten resin to the dies, (c) pouring a molten resin out of nozzles of a molding apparatus, permitting the molten resin to be guided by the heat-resisting plastic strips to the dies and then molded on the dies, and (d) marking the molded dies with marks and placing them with balls, and then separating the individually molded dies from one other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.