Flat multiple-chip module micro ball grid array packaging
US6034425A · kind A · utility
11Cited by
14References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1999 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Mar 17, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro ball grid array package is devised for a multiple-chip module (MCM). The IC chips in the package are butted together to save space. The bonding pads for the lower IC chip or chips are placed along the edges not butted with one another. The bonding pads of the chips are wire-bonded to a printed wiring plate, which has via holes through the printed wiring plate for connection to the ball grid array at the other side of the printed wiring plate and for surface mounting to a printed circuit board. A heat dissipating plate may be placed at the top of the IC chips away from the ball grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.