Patent assignee · TW · COMPANY

ChipMOS Technologies Inc.

184Patents
150Active
184Granted
54Portfolio score

Filing activity: Mar 17, 1999 → Feb 2, 2018 · 95 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US6534853B2 Semiconductor wafer designed to avoid probed marks while testing Electricity 72 Expired
US6946860B2 Modularized probe head Physics 57 Expired
US7642137B2 Manufacturing method of chip package Electricity 49 Active
US7662667B2 Die rearrangement package structure using layout process to form a compliant configuration Electricity 43 Active
US7088118B2 Modularized probe card for high frequency probing Physics 37 Expired
US7932531B2 Chip package Electricity 26 Active
US7510889B2 Light emitting chip package and manufacturing method thereof Electricity 23 Active
US7973310B2 Semiconductor package structure and method for manufacturing the same Electricity 23 Active
US7915690B2 Die rearrangement package structure using layout process to form a compliant configuration Electricity 22 Active
US7436074B2 Chip package without core and stacked chip package structure thereof Electricity 21 Expired
US7129730B2 Probe card assembly Electricity 19 Expired
US7927922B2 Dice rearrangement package structure using layout process to form a compliant configuration Electricity 19 Active
US6853205B1 Probe card assembly Physics 18 Expired
US6686615B1 Flip-chip type semiconductor device for reducing signal skew Electricity 17 Expired
US7723853B2 Chip package without core and stacked chip package structure Electricity 16 Active
US7663246B2 Stacked chip packaging with heat sink structure Electricity 15 Active
US6703075B1 Wafer treating method for making adhesive dies Electricity 14 Expired
US7662672B2 Manufacturing process of leadframe-based BGA packages Emerging Cross-Sectional Technologies 13 Active
US7615853B2 Chip-stacked package structure having leadframe with multi-piece bus bar Electricity 13 Active
US7582953B2 Package structure with leadframe on offset chip-stacked structure Electricity 12 Active
US6621710B1 Modular probe card assembly Electricity 12 Expired
US6023097A Stacked multiple-chip module micro ball grid array packaging Electricity 11 Expired
US7816771B2 Stacked chip package structure with leadframe having inner leads with transfer pad Electricity 11 Active
US6034425A Flat multiple-chip module micro ball grid array packaging Electricity 11 Expired
US6395622B1 Manufacturing process of semiconductor devices Electricity 9 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.