Polymeric polishing pad having photolithographically induced surface patterns(s) and methods relating thereto
US6036579A · kind A · utility
54Cited by
26References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Jan 12, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An innovative method of manufacturing polishing pads using photocuring polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.