Carrier head with layer of conformable material for a chemical mechanical polishing system
US6036587A · kind A · utility
49Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 1996 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Oct 10, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a chemical mechanical polishing apparatus. A layer of conformable material is disposed in a recess of the carrier head to provide a mounting surface for a substrate. The conformable material may be elastic and undergo normal strain in response to an applied load. The carrier head may also include a support fixture detachably connected to a backing fixture, a retaining ring connected directly to the conformable material, and a shield ring which projects over a portion of the layer of conformable material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.