Process of producing IC cards
US6036797A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1993 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Aug 26, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A process of producing an IC card, the IC card having a card substrate and an IC module embedded therein, the card substrate having a single core sheet and first and second cover films laminated over the core sheet on the opposite sides, the process including the steps of forming an adhesive layer on the inside of each of the first and second cover films except a non-adhesive area in which the IC module is to be fitted; bonding the cover films to the opposite sides of the core sheet through the adhesive layers to form the card substrate having the non-adhesive area; cutting the non-adhesive areas of the card substrate along their outer peripheries to form a cavity for receiving the IC module; fitting the IC module into the cavity; and fixedly securing the IC module to the card substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.