Method for making a wafer-pair having sealed chambers
US6036872A · kind A · utility
108Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Mar 31, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/561
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.