Film composition and method for a planar surface atop a plated through hole
US6037096A · kind A · utility
6Cited by
10References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | May 26, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for planarizing circuit board apertures wherein a photoimageable film composition comprising a photoimageable dielectric composition and a support film is employed to fill the circuit board apertures. Precircuitized and postcircuitized embodiments are discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.