Amarjit S. Rai
7Patents
6h-index
31Co-inventors
55Inventor score
Filing activity: Apr 8, 1997 → Oct 28, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6323436A | High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer | Electricity | 105 | Expired |
| US6207595A | Laminate and method of manufacture thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6009620A | Method of making a printed circuit board having filled holes | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6426565B1 | Electronic package and method of making same | Electricity | 16 | Expired |
| US6522014B1 | Fabrication of a metalized blind via | Electricity | 7 | Expired |
| US6037096A | Film composition and method for a planar surface atop a plated through hole | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6576549B2 | Fabrication of a metalized blind via | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.