Method for electroplating using stabilized dispersions of conductive particles
US6039859A · kind A · utility
3Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1998 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | May 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/424
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic--lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.