Multi-oxidizer precursor for chemical mechanical polishing
US6039891A · kind A · utility
28Cited by
26References
2Claims
0Family size
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Key dates
| Filing date | Jul 11, 1997 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jul 11, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing slurry precursor comprising urea, a second oxidizer, an organic acid, and an abrasive, and a method for using the chemical mechanical polishing slurry precursor to prepare a chemical mechanical polishing slurry with a first oxidizer and thereafter using the slurry to remove titanium, titanium nitride, and an aluminum alloy containing layers from a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.