Slotted lead for a semiconductor device
US6040623A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 1997 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Feb 5, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.