Vertical passive components for surface mount assembly
US6040983A · kind A · utility
19Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1998 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Mar 13, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a surface mount assembly, an active integrated circuit device, such as, for example, a dynamic random access memory, typically has a lead finger attached to a solder pad of a printed wiring board. The surface mount assembly is significantly improved by configuring a passive component, such as a resistor or capacitor, such that it has metallic terminations on an upper and lower surface so that it may be positioned between the solder pad of the printed wiring board and the lead finger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.