Thermal interface thickness control for a microprocessor
US6043560A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1997 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Dec 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for controlling the thickness of a thermal interface between a processor die and a thermal plate in a microprocessor assembly are provided. The apparatus includes a generally rectangular shaped thermal top cover having a recessed portion of predetermined depth and aperture therein. The thermal top cover fits over the processor die. A thermal interface layer fills the recessed portion of the thermal top cover covering the processor die. The depth of the recessed portion is greater than the thickness of the processor die so that the thickness of the thermal interface layer is controlled. A thermal plate is placed over the thermal top cover in contact with the thermal grease so as to form a thermal path from the processor die to the thermal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.