Robert Starkston
32Patents
9h-index
51Co-inventors
78Inventor score
Filing activity: Jan 23, 1984 → Dec 27, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6191475A | Substrate for reducing electromagnetic interference and enclosure | Electricity | 83 | Expired |
| US6617683B2 | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material | Electricity | 62 | Expired |
| US9136236B2 | Localized high density substrate routing | Electricity | 60 | Active |
| US9269701B2 | Localized high density substrate routing | Electricity | 49 | Active |
| US6043983A | EMI containment for microprocessor core mounted on a card using surface mounted clips | Electricity | 34 | Expired |
| US4539189A | Method for removing sulfides from industrial gas | Performing Operations; Transporting | 19 | Expired |
| US9679843B2 | Localized high density substrate routing | Electricity | 16 | Active |
| US4647397A | Composition for removing sulfides from industrial gas | Performing Operations; Transporting | 16 | Expired |
| US7015592B2 | Marking on underfill | Electricity | 9 | Expired |
| US7332423B2 | Soldering a die to a substrate | Emerging Cross-Sectional Technologies | 8 | Expired |
| US10366951B2 | Localized high density substrate routing | Electricity | 7 | Active |
| US7772090B2 | Methods for laser scribing wafers | Performing Operations; Transporting | 7 | Active |
| US6239973A | EMI containment for microprocessor core mounted on a card using surface mounted clips | Electricity | 6 | Expired |
| US6043560A | Thermal interface thickness control for a microprocessor | Electricity | 6 | Expired |
| US7223638B2 | Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material | Electricity | 5 | Expired |
| US9832860B2 | Panel level fabrication of package substrates with integrated stiffeners | Electricity | 4 | Active |
| US8364304B2 | Methods and apparatus for laser scribing wafers | Performing Operations; Transporting | 3 | Active |
| US9001520B2 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Emerging Cross-Sectional Technologies | 2 | Active |
| US11923257B2 | Hybrid microelectronic substrates | Electricity | 1 | Active |
| US11114353B2 | Hybrid microelectronic substrates | Electricity | 1 | Active |
| US11515248B2 | Localized high density substrate routing | Electricity | 1 | Active |
| US11022792B2 | Coupling a magnet with a MEMS device | Performing Operations; Transporting | 0 | Active |
| US10008452B2 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Emerging Cross-Sectional Technologies | 0 | Active |
| US10125013B2 | Microelectromechanical system with spring for magnet placement | Performing Operations; Transporting | 0 | Active |
| US11984396B2 | Localized high density substrate routing | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.