Device for mounting semiconductor package and method of fabricating same
US6045369A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Jul 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved device for mounting a semiconductor package when testing electrical characteristics of the semiconductor package is capable of reducing stress which is applied to the semiconductor package. The device includes a shaped body, a plurality of spaced-apart protrusions that vertically extend from a first pair of opposing upper sides of the body, a plurality of guide blocks that extend from a second pair of opposing upper sides of the body, and a plurality of leads that extend from the top surface of the body and down side surfaces of the body. The leads may include inner portions that extend inward from the first pair of opposing upper sides of the body, and outer portions that extend down the sides of the body. In addition, a plurality of guide hooks for holding a semiconductor package may be formed on upper surfaces of the protrusions and/or the guide blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.