Joon Ki Hong
7Patents
3h-index
13Co-inventors
54Inventor score
Filing activity: Aug 2, 1995 → Aug 6, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5821605A | LOC semiconductor package | Electricity | 21 | Expired |
| US6867486B2 | Stack chip module with electrical connection and adhesion of chips through a bump for improved heat release capacity | Electricity | 15 | Expired |
| US6066887A | LOC semiconductor package | Electricity | 6 | Expired |
| US6093959A | Lead frame having supporters and semiconductor package using same | Electricity | 3 | Expired |
| US8624375B2 | Semiconductor package for selecting semiconductor chip from a chip stack | Electricity | 1 | Active |
| US10372279B2 | Touch window | Physics | 1 | Active |
| US6045369A | Device for mounting semiconductor package and method of fabricating same | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.