Ductility agents for nickel-tungsten alloys
US6045682A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 1998 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Mar 24, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/562
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tungsten alloy electroplating bath. Highly ductile tungsten alloy deposits are facilitated using a sulfur co-depositing ductility additive such as: ##STR1## wherein R.sub.1 is selected from the group consisting of H.sub.1, alkyl, alkenyl, hydroxy, halogen, carboxy and carbonyl; PA1 "AR" designates a benzene or naphthalene moiety; PA1 R.sub.2 is selected from the group consisting of H, or an alkyl sulfonic acid, a Group I or Group II salt of an alkyl sulfonic acid, a benzene, a sulfonate, a naphthalene sulfonate, a benzene sulfonamide, a naphthalene sulfonamide, an ethylene alkoxy, a propylene alkoxy; and R.sub.2 may be attached to "AR" to form a cyclic moiety; and PA1 R.sub.3 is selected from the group consisting of a benzene, a naphthalene, an unsaturated aliphatic group; and a benzenesulfonate group. The additive provides ductility improvements in tungsten alloy electroplates deposited from the solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.