Chemical mechanical polishing apparatus and method
US6045716A · kind A · utility
36Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Jul 15, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/061
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Technique including a method 400 and an apparatus 100 for chemical mechanical polishing using a plurality of carrier devices 123 rotatably coupled to a turret means. The apparatus 100 includes a turret and plurality of rotatable polishing surfaces 111 positioned around the turret. The apparatus also includes a plurality of carrier devices 123 rotatably coupled to the turret, where the carrier devices 123 are each adapted to hold a workpiece to be polished on at least one of the rotatable polishing surfaces. Each of the carrier devices is operably independently to each other during a process for chemical mechanical polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.