Strasbaugh
🏢 View company profile →76Patents
19Active
76Granted
42Portfolio score
Filing activity: Jul 15, 1997 → Oct 27, 2014 · 9 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6146242A | Optical view port for chemical mechanical planarization endpoint detection | Performing Operations; Transporting | 67 | Expired |
| US7249992B2 | Method, apparatus and system for use in processing wafers | Electricity | 59 | Expired |
| US5964646A | Grinding process and apparatus for planarizing sawed wafers | Performing Operations; Transporting | 47 | Expired |
| US6520843B1 | High planarity chemical mechanical planarization | Performing Operations; Transporting | 46 | Expired |
| US5961169A | Apparatus for sensing the presence of a wafer | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6045716A | Chemical mechanical polishing apparatus and method | Performing Operations; Transporting | 36 | Expired |
| US6551179B1 | Hard polishing pad for chemical mechanical planarization | Performing Operations; Transporting | 32 | Expired |
| US6361647B1 | Method and apparatus for chemical mechanical polishing | Electricity | 24 | Expired |
| US6131589A | Accurate positioning of a wafer | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6346036B1 | Multi-pad apparatus for chemical mechanical planarization | Performing Operations; Transporting | 22 | Expired |
| US6629874B1 | Feature height measurement during CMP | Performing Operations; Transporting | 20 | Expired |
| US6254155A | Apparatus and method for reliably releasing wet, thin wafers | Electricity | 20 | Expired |
| US6183341A | Slurry pump control system | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6227956A | Pad quick release device for chemical mechanical polishing | Performing Operations; Transporting | 18 | Expired |
| US6602121B1 | Pad support apparatus for chemical mechanical planarization | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6102057A | Lifting and rinsing a wafer | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6464574B1 | Pad quick release device for chemical mechanical planarization | Performing Operations; Transporting | 13 | Expired |
| US6485354B1 | Polishing pad with built-in optical sensor | Performing Operations; Transporting | 13 | Expired |
| US6517419B1 | Shaping polishing pad for small head chemical mechanical planarization | Performing Operations; Transporting | 12 | Expired |
| US6547651B1 | Subaperture chemical mechanical planarization with polishing pad conditioning | Performing Operations; Transporting | 12 | Expired |
| US6726528B2 | Polishing pad with optical sensor | Performing Operations; Transporting | 12 | Expired |
| US6739945B2 | Polishing pad with built-in optical sensor | Performing Operations; Transporting | 11 | Expired |
| US6855030B2 | Modular method for chemical mechanical planarization | Electricity | 11 | Expired |
| US7033252B2 | Wafer carrier with pressurized membrane and retaining ring actuator | Performing Operations; Transporting | 11 | Expired |
| US6885206B2 | Device for supporting thin semiconductor wafers | Physics | 11 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.