Dual substrate package assembly having dielectric member engaging contacts at only three locations
US6046911A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Feb 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10704
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to conductors of a second substrate. These conductors are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. These conductors are in contact with the dielectric member at only three locations before the dielectric is connected to the electronic package assembly and the conducting member. Ready separability of various parts of the assembly is thus assured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.