Method of forming electrically conductive pillars
US6049977A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 1997 |
| Grant date | Apr 18, 2000 |
| Priority date | — |
| Expiry date | May 15, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming electrically conductive pillars on a printed circuit board by providing a printed circuit board having a plurality of electrical traces and forming a plurality of elongate, electrically conductive pillars of superimposed layers of solder and conductive polymer on the printed circuit board. The elongate, electrically conductive pillars are connected by a first end to the electrical traces of the printed circuit board and extend substantially perpendicularly from the printed circuit board such that a second end of each of the plurality of elongate, electrically conductive pillars lies in substantially a common plane which is substantially perpendicular to and above said printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.