Method and apparatus for cooling an electronic device
US6050326A · kind A · utility
69Cited by
14References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 1998 |
| Grant date | Apr 18, 2000 |
| Priority date | — |
| Expiry date | May 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation apparatus for cooling one or more electronic devices. The apparatus utilizes a moving heat sink a portion of which is in contact with the device to be cooled. The moving heat sink may be in the form of a rotating disk, moving belt or strip. The heat sink may be made from various materials such as metals or plastics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.