David L. Gardell
42Patents
11h-index
89Co-inventors
78Inventor score
Filing activity: Oct 15, 1992 → Oct 18, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6275051A | Segmented architecture for wafer test and burn-in | Physics | 73 | Expired |
| US6050326A | Method and apparatus for cooling an electronic device | Electricity | 69 | Expired |
| US6351134B2 | Semiconductor wafer test and burn-in | Physics | 69 | Expired |
| US6086387A | Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing | Physics | 51 | Expired |
| US5929651A | Semiconductor wafer test and burn-in | Physics | 48 | Expired |
| US5585600A | Encapsulated semiconductor chip module and method of forming the same | Electricity | 38 | Expired |
| US6012020A | Apparatus and method for monitoring the condition of septic tanks | Chemistry; Metallurgy | 21 | Expired |
| US6504392B2 | Actively controlled heat sink for convective burn-in oven | Physics | 15 | Expired |
| US6911836B2 | Apparatus for functional and stress testing of exposed chip land grid array devices | Physics | 15 | Expired |
| US5628889A | High power capacity magnetron cathode | Electricity | 14 | Expired |
| US6173760A | Co-axial bellows liquid heatsink for high power module test | Electricity | 13 | Expired |
| US7259580B2 | Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test | Physics | 11 | Expired |
| US8471575B2 | Methodologies and test configurations for testing thermal interface materials | Physics | 10 | Active |
| US6720789B1 | Method for wafer test and wafer test system for implementing the method | Physics | 10 | Expired |
| US7084651B2 | Probe card assembly | Physics | 8 | Expired |
| US6577146B2 | Method of burning in an integrated circuit chip package | Physics | 7 | Expired |
| US5252062A | Thermal processing furnace | Mechanical Engineering; Lighting; Heating | 6 | Expired |
| US7567090B2 | Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application | Physics | 5 | Active |
| US8002025B2 | Containment of a wafer-chuck thermal interface fluid | Electricity | 4 | Active |
| US6590404B2 | Force and centrality measuring tool | Physics | 3 | Expired |
| US9116200B2 | Methodologies and test configurations for testing thermal interface materials | Physics | 2 | Active |
| US7808099B2 | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method | Chemistry; Metallurgy | 2 | Active |
| US7684194B2 | Systems and methods for cooling an electronic device | Emerging Cross-Sectional Technologies | 2 | Active |
| US9797928B2 | Probe card assembly | Physics | 2 | Active |
| US8686749B2 | Thermal interface material, test structure and method of use | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.