Thermal conditioning apparatus
US6051074A · kind A · utility
11Cited by
37References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1999 |
| Grant date | Apr 18, 2000 |
| Priority date | — |
| Expiry date | Feb 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer support including a plate having a top surface and a lift element opening extending trough said plate. The support also includes a support member adjacent the top surface having a proximal end, a distal end and a bore from the proximal to the distal end and a vacuum source in communication with the bore. The support furthermore includes a lift element having a contacting end disposed through the lift element opening and a drive coupled to at least one of the plate and the lift element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.