Device and method for polishing a semiconductor substrate
US6051500A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Apr 18, 2000 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method for polishing a semiconductor substrate having a first layer of material formed on a second layer of different material. In one embodiment, the method includes placing the semiconductor substrate against a polishing surface and polishing the semiconductor substrate, producing a first vibration by polishing and removing the first layer, producing a second vibration by polishing at least a portion of the second layer, and detecting a change from the first vibration to the second vibration with a vibration sensor. The vibration that is sensed in the present invention is physical or mechanical vibration, and it is not a vibration associated with a change in temperature. The vibration sensor may be of varying types. For example, the vibration sensor may be an acoustic sensor or an ultrasonic sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.