Manufacture method for micromechanical devices
US6053617A · kind A · utility
25Cited by
8References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 1994 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Sep 23, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0841
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for manufacturing micromechanical devices. The process includes the step of covering the activation circuitry (201) and those parts of the device that come in contact with moving parts with a pad film (202). The pad film prevents frictional wear and sticking of the moving parts, and can prevent electrical shorts between different parts of the activation circuitry. Additionally, the pad film can prevent particulates from interfering with the operation of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.